Have you ever wondered how each process steps affect the Si wafer and the subsequent process steps? These days, the films are getting thinner and thinner. It is often no longer valid to assume the characteristics of the substrate or film based on experience or old measurement techniques. Furthermore, Stress is found to be affecting the device performance and reliability as the device size is becoming smaller and smaller.

WaferMasters developed new tools to non-destructively characterize the wafers stress at various depths.

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