The OSP-300 system design is based on an optical
interaction between a light source and
semiconductor wafers as a non-destructive
wafer-surface profile characterization and process
monitoring tool for R&D and manufacturing
applications. The system provides new insights
into wafer characteristics and process effects, with
a minimum cost of ownership.
Applications
Nondestructive Wafer Characterization and
In-Line Process Monitoring
Wafer Flatness
Wafer Curvature
Height Contour Maps
Vector Plots
Distortion Histogram, etc.
Key Benefits & Specifications
Simple and Robust Design
Excellent Sensitivity to
- Surface Flatness
- Local Distortion
- Global Warpage
- Pattern Rotation
- Twist and Distortion
Important In-Line Process Monitoring
Information
- Wafer Flatness
- Wafer Curvature
- Height Contour Maps
- Vector Plots
- Distortion Histogram, etc.
Nondestructive Optical Characterization
No Sample Preparation
Can Sample All Wafers
- Blanket
- Processed
- Patterned
- Device Wafers
Fast Start up (same day)
Minimum Consumables
Minimal Facility Requirement:
- Electricity:
3phase 220VAC 10kVA
- CDA: 0.55 MPa
- Vacuum: -60kPa
Small Footprint
Built-in Two FOUP Openers
Customers are strongly encouraged to discuss current
processing problems and new applications with WaferMasters' technical staffs
at our various locations. WaferMasters is willing to assist you to find
simple and natural processing / equipment solutions.
