DESIGN PHILOSPHY PROCESSES MEASURMENTS PRODUCT SPECS
MINI BATCH FURNACE
MBF-300
 
1050mm (W) X 1600mm (D) X 2000mm (H)
The MBF-300 system is designed based on a resistively heated furnace technology to enhance lot size flexibility and reduce cycle time for annealing and LPCVD applications up to 1000°C. The system processes twenty five wafers per batch and provides excellent process repeatability and stability in addition to the lot size flexibility.
 
 
 Applications
Silicidation (TiSi, CoSi, NiSi, WSi etc.)
Implant anneal
Oxidation (Dry & Wet)
Glass reflow
Film Densification
 
 
 Key Benefits & Specifications
Simple and Robust Design
Excellent Process Uniformity & Repeatability
Stable and Reliable System Performance
Small Footprint
Energy Efficient (Power Consumption < 5kW / Chamber)
Vertically Stacked Dual Process Chambers
Timely and Cost Effective Device Manufacturing
Reduce Capital Investment
 
   
 
  Customers are strongly encouraged to discuss current processing problems and new applications with WaferMasters' technical staffs at our various locations. WaferMasters is willing to assist you to find simple and natural processing / equipment solutions.