The MBF-201 system is designed
based on a resistively heated furnace technology to enhance
lot size flexibility and reduce cycle time for annealing and
LPCVD applications up to 1000°C. The system processes twenty
five wafers per batch and provides excellent process repeatability
and stability in addition to the lot size flexibility.
Applications
Silicidation (TiSi,
CoSi, NiSi, WSi etc.)
Implant anneal
Oxidation (Dry &
Wet)
Glass
reflow
Film Densification
Al
Sintering
Cu
Annealing
H2
Annealing
Polymide
Bake
SiLK
Annealing
SOG
Annealing
Photoresist
Bake & Reflow
Low-k
Dielectrics Annealing
LPCVD
Key Benefits & Specifications
Compact Design
Ambient: AP and
LP Operation in 1 atm Air
- AP and LP compatible
- Inert and most process
gases
Wide Operating
Termperaure Range: 100~1000°C
Process Uniformity:<2%
(1 sigma)
Process Repeatability:
<5°C
Batch Size: 25
wafers (1 cassette)
Competitive Throughput:~25wph
(1 batch/hr)
Fast Installation:
1 day
Process Qualification:
3 days
Maintenance:
every 3 to 6 months
Minimum Consumables:
- Quartz boat,
heater units
- O-rings
Facility
Requirement
- Electricity: 3 phase 220VAC
50A
- Process gases: up to 4
lines
- Cooling water: 5 Liter/min
Small Footprint
Energy Efficient
(Power Consumption < 15kW)
Customers are strongly encouraged to discuss current
processing problems and new applications with WaferMasters' technical staffs
at our various locations. WaferMasters is willing to assist you to find
simple and natural processing / equipment solutions.
