DESIGN PHILOSPHY PROCESSES MEASURMENTS PRODUCT SPECS
STACKED ANNEALING OVEN
SAO-301LP
 
1050mm (W) x 1600mm (D) x 2000mm (H)
 
- Vacuum Pump Inlcuded
- Monitor Space Extra
The SAO-301LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.
 
 
 Applications
Cu Annealing
Al Sintering
H2 Annealing
SOD Annealing
Low-k Dielectrics Annealing
Polyimide Bake
SiLK Annealing
Silicidation (NiSi)
Photoresist Bake & Reflow
Low Temperature LPCVD
 
 
 Key Benefits & Specifications
Simple and Robust Design
Vacuum Compatible & Ambient Control
- low residual O2 (<5ppm)
- H2 or forming gas compatible
Operating Temperature Range
- 100 ~ 450°C
- H2 or forming gas compatible
Excellent Process Uniformity: <1%
Excellent Process Repeatability: <3°C (range)
Competitive Throughput: 25 wph (5 min process)
Fast Installation: 0.5 day
Process Qualification: 1 day
Minimal Maintenance: every 6 to 12 months
No Consumables
Minimal Facility Requirement:
- Electricity: 3phase 220VAC 30A
- Process gases: up to 2 lines
- Cooling water
Small Footprint
Energy Efficient: < 7KW steady state, 12 KW max
Built-in Two FOUP Openers
 
   
 
  Customers are strongly encouraged to discuss current processing problems and new applications with WaferMasters' technical staffs at our various locations. WaferMasters is willing to assist you to find simple and natural processing / equipment solutions.