DESIGN PHILOSPHY PROCESSES MEASURMENTS PRODUCT SPECS
LOW TEMPERATURE FURNACE
LTF-300LP
 
1050mm (W) x 1600mm (D) x 2000mm (H)
 
-Monitor Space Extra
The LTF-300LP system is designed based on a resistively heated, stacked hot plate technology to address ambient controlled, low temperature annealing applications up to 250°C. The system processes thirteen wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.
 
 
 Applications
SOG bake and cure
Photoresist reflow
Cu anneal
Polyimide bake
 
 
 Key Benefits & Specifications
Simple and Robust Design
Operating Temperature Range
- 100 ~ 250°C
Vacuum Compatible & Ambient Control
- low residual O2 (<5ppm)
- H2 or forming gas compatible
Excellent Process Uniformity: <1% (1 sigma)
Excellent Process Repeatability: <3°C (range)
Competitive Throughput
Fast Installation: 0.5 day
Process Qualification: 0.5 day
Minimal Maintenance: every 12 months
No Consumables
Minimal Facility Requirement:
- Electricity only : 3 phase 220VAC 30A
Small Footprint
Energy Efficient: < 5KW steady state, 7KW max
Built-in Two FOUP Openers
 
   
 
  Customers are strongly encouraged to discuss current processing problems and new applications with WaferMasters' technical staffs at our various locations. WaferMasters is willing to assist you to find simple and natural processing / equipment solutions.
   
      Back to Top
   
  Copyright © 2002 WaferMasters, Inc. All rights reserved.