DESIGN PHILOSPHY PROCESSES MEASURMENTS PRODUCT SPECS

STACKED ANNEALING OVEN SAO-200LP   600mm (W) x 1200mm (D) x 1700mm (H) -Vacuum Pump Included -Monitor Space Extra The SAO-200LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.      Applications Cu Annealing Al Sintering H2 Annealing SOD Annealing Low-k Dielectrics Annealing Polyimide Bake SiLK Annealing Silicidation (NiSi) Photoresist Bake & Reflow Low Temperature LPCVD      Key Benefits & Specifications Simple and Robust Design Vacuum Compatible & Ambient Control - low residual O2 (<5ppm) - H2 or forming gas compatible Operating Temperature Range - 100 ~ 450°C - H2 or forming gas compatible Excellent Process Uniformity: <1% Excellent Process Repeatability: <3°C (range) Competitive Throughput: 25 wph (5 min process) Fast Installation: 0.5 day Process Qualification: 1 day Minimal Maintenance: every 6 to 12 months No Consumables Minimal Facility Requirement: - Electricity, 2 process gases, cooling water Small Footprint Energy Efficient: < 5 KW steady state, 10 KW max           Customers are strongly encouraged to discuss current processing problems and new applications with WaferMasters' technical staffs at our various locations. WaferMasters is willing to assist you to find simple and natural processing / equipment solutions.           Back to Top

Copyright © 2002 WaferMasters, Inc. All rights reserved.