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STACKED
ANNEALING OVEN
SAO-200AP
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| 600mm
(W) x 1200mm (D) x 1700mm (H) |
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| The SAO-200AP system is designed
based on a resistively heated, stacked process module technology to address ambient
controlled, low temperature annealing applications up to 450°C. The system
processes five wafers simultaneously and provides excellent process repeatability
and stability at a minimum cost of ownership. |
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| Applications |
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| SOG
bake and cure |
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| Photoresist
reflow |
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| Low-k
dielectrics anneal |
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| SOI
wafer bonding/splitting |
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| Polyimide
bake |
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| SiLK
annealing |
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| Wafer
bumping |
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| Key Benefits & Specifications |
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| Simple and Robust Design |
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| Operation in
1atm Air: |
| - No process
gas required |
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| Operating Temperature Range |
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| Excellent Process Uniformity:
<1% (1 sigma) |
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| Excellent Process Repeatability:
<3°C (range) |
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| Competitive Throughput: 40wph
(5 min process) |
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| Fast Installation: 0.5 day |
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| Process Qualification: 0.5
day |
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| Minimal Maintenance: every
12 months |
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| No Consumables |
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| Minimal Facility Requirement:
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| Small Footprint |
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| Energy Efficient: < 3KW
steady state, 5KW max |
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Customers are strongly encouraged to discuss current
processing problems and new applications with WaferMasters' technical staffs
at our various locations. WaferMasters is willing to assist you to find
simple and natural processing / equipment solutions. |
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