WaferMasters | Products | PRODUCT SPECS

SINGLE-WAFER RAPID THERMAL FURNACE
SRTF-302LP



1103mm (W) x 3379mm (D) x 1925mm (H)
	- Vacuum Pump Included
	- Monitor Space Extra

The SRTF-302LP system is designed based on a resistively heated, single wafer furnace technology to address conventional batch furnace thermal applications as well as RTP applications up tp 1100°C. The system provides excellent process repeatability and stability at a minimum cost of ownership.

Applications

Silicidation (TiSi, CoSi, NiSi, WSi etc.)

Implant anneal

Oxidation (Dry & Wet)

Glass reflow

Film Densification

Key Benefits & Specifications


Simple and Robust Design

Oxygen-Free Ambient: <30ppm

Two Vacuum Capable load locks

Built-in Two FOUP Openers

Wide Operating Termperaure Range: 200~1100°C

Excellent Process Uniformity:<1%(1sigma)

Excellent Process Repeatability: <3°C

Wide Process Window

Fast Ramp Rate: up to 100°C/s at 1100°C

Competitive Throughput

Fast Installation: 1day

Process Qualification: 1day

Minimum Maintenance: every 6 to 12 months

Minimum Consumables:
	- Quartz tubes, thermocouples, heater units
	- O-rings

Minimal Facility Requirement
	- Electricity: 3 phase 220VAC 25kVA
	- Process gases: up to 2 lines
	- Cooling water

Small Footprint

Energy Efficient (Power Consumption < 10kW at 1100°C)

Customers are strongly encouraged to discuss current processing problems and new applications with WaferMasters' technical staffs at our various locations. WaferMasters is willing to assist you to find simple and natural processing / equipment solutions.