WaferMasters | Products | PRODUCT SPECS

SINGLE-WAFER RAPID THERMAL FURNACE
SRTF-201LP




844mm(W) X 2282mm (D) X 2072mm (H)
	- Vacuum Pump Included
	- Monitor Space Extra

The SRTF-201LP system is designed based on a resistively heated, single wafer furnace technology to address conventional batch furnace thermal applications as well as RTP applications up tp 1150°C. The system provides excellent process repeatability and stability at a minimum cost of ownership.

Applications

Silicidation (TiSi, CoSi, NiSi, WSi etc.)

Implant anneal

Oxidation (Dry & Wet)

Glass reflow

Film Densification

Key Benefits & Specifications


Simple and Robust Design

Vacuum Compatible

Wide Operating Termperaure Range: 200~1150°C

Excellent Process Uniformity:<1%(1sigma)

Excellent Process Repeatability: <3°C

Wide Process Window

Fast Ramp Rate: up to 150°C/s at 1100°C

Competitive Throughput:~40wph (60s process)

Fast Installation: 1day

Process Qualification: 1day

Minimum Maintenance: every 6 to 12 months

Minimum Consumables:
	- Quartz tubes, thermocouples, heater units
	- O-rings

Minimal Facility Requirement
	- Electricity: 3 phase 220VAC 100A
	- Process gases: up to 2 lines
	- Cooling water: 5 Liter/min

Small Footprint

Vertically Stacked Dual Chambers

Energy Efficient (Power Consumption < 5kW / Chamber)

Customers are strongly encouraged to discuss current processing problems and new applications with WaferMasters' technical staffs at our various locations. WaferMasters is willing to assist you to find simple and natural processing / equipment solutions.