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THERMAL PROCESSING

Design Considerations
Designing for highest yields for today’s Advanced Technology nodes (45nm and below) requires specific process architectures and an understanding of the physics of semiconductor processing.  From the perspective of the architecture, we consider thermal transport mechanisms (conduction, convection and radiation) and how to minimize uncertainties, errors and variables. When we consider a patterned wafer from the perspective of the physics of processing, the wafer employs many materials which means variation of thermal effects from emissivity and thermal expansion. In addition, there are many different pattern periodicities (similar to diffraction gratings of different spacings) which couple to many frequencies in the visible spectrum. These facts give rise to what we observe as “the pattern effect”, thermal non-uniformity of processing, and are exacerbated when photons (lamps) are used as the main heating mechanism.


How WaferMasters Achieves Superior Yields and Performance
Superior on-Wafer REPEATABILITY is the Key to Yield Improvement. Once the process is qualified,

     REPEATABILITY = YIELD…

Compact Isothermal Process Module Design Is the KEY – The Process Module provides a very large, stable thermal mass which efficiently transfers heat to the wafer. The process module is maintained at a consistent temperature. The thermal characteristics of the module remain invariant. Thus on-wafer results are REPEATABLE wafer to wafer, week to week and month to month!

Excellent Uniformity – The Process Module presents a nearly Isothermal environment to the wafer which translates to excellent on-wafer uniformity.

Minimum Added Stress - The Isothermal process environment minimizes thermal stress by keeping the wafer in thermal equilibrium as much as possible.

Minimum Pattern Effect - No Lamps.  WaferMasters minimizes radiation transfer using conduction and convection as thermal transfer mechanisms. There is never any thermal overshoot!

Reliability by Design - MTBF > 5000hr (greater than 7 months!). WaferMasters’ design leaves nothing to chance. Moving parts, interlocks and unnecessary complexity are minimized.  

WaferMasters Leaves Nothing to Chance - Minimum Variables, Minimum Uncertainty = Maximum Repeatability     WaferMasters’ Un-Compromising Design Rules reduces uncertainty and errors in every detail.

 


DIAGNOSTIC METROLOGY
Design Considerations
With the greater challenges of Advanced technology nodes, for the process engineer, the need for greater insight and knowledge of the real effects of wafer process steps becomes essential if yields and performance are to be competitive. WaferMasters needed this information, as well, to develop thermal process solutions.  Work on WaferMasters' suite of Diagnostic Metrology tools, developed over the last 6 years (Micro-Raman Spectroscopy, Photoluminescence, Surface Profiling), was guided by the challenges of current technology nodes. The need for stability, repeatability, low signal-to-noise resolution capability and measurements at different depths into the silicon, all on a non-contact basis, demanded new instrument designs and disciplines.
 
How WaferMasters Achieves Superior Measurement Performance
Superior Measurement Stability and Reproducibility - No moving parts and Fixed Optics where possible. No discernable drift wafer to wafer, or week to week.
 
Greater Measurement Resolution - Long focal length with minimum "folding" for greater linear deflection per wavenumber and special monochromator design.
 
Virtual Drill Down Capability -  Multi-wavelength capability for different penetration depths by selectable, multi-line laser with fixed optics.
 
Intuitive Display Functionality -  Data displayed with versatile display parameters to conceptualize statistically analyzed results.