Design Considerations
With the greater challenges of Advanced technology nodes, for the process engineer, the need for greater insight and knowledge of the real effects of wafer process steps becomes essential if yields and performance are to be competitive. WaferMasters needed this information, as well, to develop thermal process solutions. Work on WaferMasters' suite of Diagnostic Metrology tools, developed over the last 6 years (Micro-Raman Spectroscopy, Photoluminescence, Surface Profiling), was guided by the challenges of current technology nodes. The need for stability, repeatability, low signal-to-noise resolution capability and measurements at different depths into the silicon, all on a non-contact basis, demanded new instrument designs and disciplines.
How WaferMasters Achieves Superior Measurement Performance
 Superior Measurement Stability and Reproducibility - No moving parts and Fixed Optics where possible. No discernable drift wafer to wafer, or week to week.
 Greater Measurement Resolution - Long focal length with minimum "folding" for greater linear deflection per wavenumber and special monochromator design.
Virtual Drill Down Capability - Multi-wavelength capability for different penetration depths by selectable, multi-line laser with fixed optics.
 Intuitive Display Functionality - Data displayed with versatile display parameters to conceptualize statistically analyzed results.
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