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Records 1 to 8 of 8

	2008/06/25 - WaferMasters Introduces the MRS-300 Multi-Wavelength Raman Spectrometer for Non-Destructive Wafer Strain and Crystal Quality Characterization.
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	2008/06/25 - WaferMasters Introduces the OSP-300 Optical Surface Profilometer for Non-Destructive Wafer Surface Profiling and Characterization
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	2003/12/02 - WaferMasters Introduces New Flash Annealing System for Sub-90nm Semiconductor Technology Manufacturing
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	NEWS COVERAGE
	2003/09/01 -- “Advanced devices using low-temperature NiSi formation”, Solid State Technology, September 2003 edition 2001/09/20 -- "Furnace Based Single Wafer Annealing System" The Nikkei Business Daily - Technology Development Column (in Japanese) 2001/08/21 -- "Energy Efficient Thermal Processing System" The Nikkei Business Daily - Cover Story (in Japanese) 2001/03/21 -- "Can WaferMasters Revolutionize in Semiconductor Equipment Business?" Semiconductor FPD World, Vol. 4 (2001) 74. (in Japanese) 2000/12/01 -- "WaferMasters' Annealing Product & RTP Product" Electronic Journal, Vol. 11 (2000) 163. (in Japanese)

	2003/08/11 - WaferMasters' RTP equipment improves SOG annealing process at STMicroelectronics' AG-1 wafer fabrication facility in Italy.
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	2003/07/15 - WaferMasters Introduces Industry’s First Low-Cost Mini Batch Furnace for 200 mm and 300 mm Semiconductor Wafer Fabrication
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	2003/07/11 - WaferMasters’ chip manufacturing equipment leads to record productivity for NEC Hiroshima Ltd, a leading Japanese producer of advanced memory products.
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	2002/07/18 – WaferMasters Introduces Industry's First System Designed for Copper Annealing
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