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Mission Statement To be recognized as the technology leader in innovative and cost effective thermal processing equipment for the semiconductor industry. WaferMasters was born of a desire to challenge some of the design paradigms that are limiting creativity and productivity in the semiconductor industry. In our first few years we have been busy; here are some of the highlights and milestones:   MAY 1999   WaferMasters, Inc. established in California by Taro Yamazaki (CEO) and Woo Sik Yoo (CTO), both from Mattson Technology, to serve the semiconductor manufacturing industry.     MAY 1999   Received large development contract from Tokyo Electron Ltd. (TEL) to develop a unique Single Wafer Rapid Thermal Furnace (SRTF-200 for 200 mm wafers).     JULY 1999   WaferMasters Japan, KK established in Yamato, Japan.     DECEMBER 1999   Shipped the first 200 mm evaluation system (SAO-200AP) to a leading Japanese device manufacturer for SOG annealing application under WaferMasters brand name.     MAY 2000   Shipped the first 200 mm production system (SAO-200AP) to a leading Japanese device manufacturer for SOG annealing application.     MAY 2000   Shipped the first 200 mm SRTF system (SRTF-200) to a leading Japanese device manufacturer for silicidation, dry/wet oxidation, implant annealing applications under TEL's brand.     DECEMBER 2000   Shipped the first 300 mm production system (SAO-300LP) to a major fab in Japan for H2 annealing, Al sintering and Cu annealing applications.     FEBRUARY 2001   Shipped multiple 150 mm production systems (SAO-150LP) to the first 150 mm GaAs device manufacturer in Japan for GaAs annealing and oxidation applications.     MARCH 2001   WaferMasters Opens branch office in Paris, France.     JUNE 2001   Granted US patent for unique wafer processing system (Mini Batch Furnace).     JUNE 2001   WaferMasters Service Factory established in Kumamoto, Japan.     OCTOBER 2001   Completed 200 mm SRTF development contract and transferred manufacturing technology to TEL.     DECEMBER 2001   Shipped the first 300 mm SRTF evaluation system (SRTF-300AP) to the first 300 mm wafer fab in Japan for film densification, dry oxidation, implant annealing applications.     APRIL 2002   Received large development contract from TEL for 300 mm Single Wafer Rapid Thermal Furnace (SRTF-300). Shipped the second 300 mm SRTF evaluation system (SRTF-300LP) to TEL for evaluating O2 free RTP applications.     APRIL 2002   Released Table Top Furnace (TTF-100) at Semicon Europa for small size (25~100 mm diameter) annealing and oxidation applications.     APRIL 2002   WaferMasters opens branch office in Sinsheim, Germany.     MAY 2002   Merged WaferMasters Japan, KK into WaferMasters Service Factory (Kumamoto, Japan).     JUNE 2002   Shipped multiple 200 mm SAO systems (SAO-200AP & LP) to a leading European device manufacturer for SOG anneal and Cu annealing applications.

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